8 Layers ENIG HDI PCB Circuit Board Fabrication

HDI PCB fabrication is rapidly becoming the ultimate solution for smaller, more efficient, and more durable PCBs. High-Density Interconnect (HDI) is a high-performance design that is characterized by its high density of components and routing Interconnections that use micro vias, blind and buried via or micro via techniques, and built-up Print Circuit Boards (PCBs) laminations. HDI PCB design is preferable for reducing the overall cost;this isdone by decreasing the size and the number of layers as compared to a standard technology PCB design. It also offers better electrical performance and is one of the key technologies driving advancements in PCB electronics.

The Six Main Types Of HDI PCB Boards

1. Burial through and through channels
2. Use core-free structure with layer pairs.
3. Passive substrate, no electrical connection
4. By surface to surface offset
5. Two / more HDI layers and vias
6. A core-free alternative structure using a pair of layers

Our Service

1.Quick Quotation: Competitive factory direct price is always offered.

2.Free Sample: Before mass production, we offer Sample for free.

3.Quality Control: Complete test procedure is arranged before delivery.

4.On Time Delivery: According to customer's requirement and the lead time can be negotiated.

About Yue Tong Electronic

Offering from low quantity to mass production, with high quality available at a low cost. So if you are looking to get the best and affordable HDI PCB manufacturing service, welcome to contact us for more information.

Hot Tags: 8 layers enig hdi pcb circuit board fabrication, China, manufacturers, suppliers, custom, OEM, contract manufacturing, turnkey service, one stop service, GPS PCB Board Assembly, High-density Multilayer Printed PCB For Phone, Multilayer PCB, Led Strip Single Side Aluminum PCB Board, FR4 Printed Circuit Assembly, Audio Amplifier PCB Circuit Board Assembly