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Good price 8 Layers ENIG HDI PCB Circuit Board Fabrication online Video

8 Layers ENIG HDI PCB Circuit Board Fabrication

Product Attributes: Burial Through And Through Channels,Use Core-free Structure With Layer Pairs,Passive Substrate, No Electrical Connection

Packaging Details: carton box

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High Density Multilayer Circuit Board For Phone Medical Devices

Density Transmission: Higher

Computing: Efficient

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8 Layer Multilayer HDI PCB Board FR4 1.6mm TG 180 1 OZ

Layer Count: 8

Material: FR4 ,1.6mm, TG 180, 1 OZ For All Layer

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3mil 4mil 3-8oz HDI PCB Board Manufacturer 1-28 Layers

Technology Capability: 3mil/3mil,3-8 Oz,4mil

Minimum Order Quantity Requirement: No Minimum Order Quantity Requirement

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