Product Attributes: Burial Through And Through Channels,Use Core-free Structure With Layer Pairs,Passive Substrate, No Electrical Connection
Packaging Details: carton box
Density Transmission: Higher
Computing: Efficient
Layer Count: 8
Material: FR4 ,1.6mm, TG 180, 1 OZ For All Layer
Technology Capability: 3mil/3mil,3-8 Oz,4mil
Minimum Order Quantity Requirement: No Minimum Order Quantity Requirement
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